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Conference Paper Cost-Effective and High-Performance FBAR Duplexer Module with Wafer Level Packaging
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Authors
Hyun-Cheol Bae, Sung-Chan Kim, Jong-Tae Moon, Kwang-Seong Choi
Issue Date
2011-12
Citation
Asia-Pacific Microwave Conference (APMC) 2011, pp.1074-1077
Publisher
IEEE
Language
English
Type
Conference Paper
KSP Keywords
High performance, Wafer Level Packaging, cost-effective
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