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Journal Article Postfabrication Annealing Effects on Insulator-Metal Transitions in VO2 Thin-Film Devices
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Authors
Servin Rathi, In-yeal Lee, Jin-Hyung Park, Bong-Jun Kim, Hyun-Tak Kim, Gil-Ho Kim
Issue Date
2014-11
Citation
ACS Applied Materials & Interfaces, v.6, no.22, pp.19718-19725
ISSN
1944-8244
Publisher
American Chemical Society(ACS)
Language
English
Type
Journal Article
DOI
https://dx.doi.org/10.1021/am5046982
Abstract
(Figure Presented) In order to investigate the metal-insulator transition characteristics of VO2 devices annealed in reducing atmosphere after device fabrication at various temperature, electrical, chemical, and thermal characteristics are measured and analyzed. It is found that the sheet resistance and the insulator-metal transition point, induced by both voltage and thermal, decrease when the devices are annealed from 200 to 500 °C. The V 2p3/2 peak variation in X-ray photoelectron spectroscopy (XPS) characterization verifies the reduction of thin-films. A decrease of the transition temperature from voltage hysteresis measurements further endorse the reducing effects of the annealing on VO2 thin-film.
KSP Keywords
Annealing effects, Hysteresis measurements, Reducing atmosphere, Thermal Characteristics, Transition Point, Voltage hysteresis, X-ray photoelectron spectroscopy (xps), device fabrication, insulator-metal transition, metal-insulator transition, sheet resistance