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Journal Article
Application of Thermal Initiator for Characteristic Improvements of Polymeric Replica Mold for UV Nanoimprint Lithography
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- Authors
- Ye-Sul Jeong, Jaehoon Park, Bong Kuk Lee, Jin-Hwa Ryu, Kyu-Ha Baek, Lee-Mi Do
- Issue Date
- 2014-12
- Citation
- Journal of Nanoscience and Nanotechnology, v.14, no.8, pp.5932-5936
- ISSN
- 1533-4880
- Publisher
- American Scientific Publishers (ASP)
- Language
- English
- Type
- Journal Article
- Abstract
- We report the improvement of the hardness and modulus properties in a silsesquioxane-based soft replica mold by adding thermal initiator, without deteriorating the UV transmittance at the wavelength of 365 nm. It is found that thermal initiator used for this work contributes to improving the hardness and modulus values up to 0.175 and 3.585 GPa, while the UV transmittance value is still above 75%. The optimized soft replica mold built on a flexible plastic substrate allows submicron-scale patterns to be transferred onto a rigid Si substrate by means of UV-NIL process. Consequently, we demonstrate that the developed soft replica mold can be a suitable replacement for typical hard molds, promising further use in mold-based nanolithography for the fabrication of high-resolution nanopatterns over large areas. Copyright © 2014 American Scientific Publishers.
- KSP Keywords
- 65 nm, Hardness and modulus, High resolution, Nanoimprint lithography(NIL), Plastic substrate, Replica mold, Si substrate, Thermal initiator, UV nanoimprint lithography(UV-NIL), UV transmittance, modulus properties