상세정보
학술지
Application of Thermal Initiator for Characteristic Improvements of Polymeric Replica Mold for UV Nanoimprint Lithography
- 발행일
- 201412
- 출처
- Journal of Nanoscience and Nanotechnology, v.14 no.8, pp.5932-5936
- ISSN
- 1533-4880
- 출판사
- American Scientific Publishers (ASP)
- 협약과제
- 13VC5400, 150ºC이하 인쇄기반 플렉세블 디스플에이 백플레인용 산화물 반도체, 절연체 잉크소재 및 공정 기술 개발, 도이미
- 초록
- We report the improvement of the hardness and modulus properties in a silsesquioxane-based soft replica mold by adding thermal initiator, without deteriorating the UV transmittance at the wavelength of 365 nm. It is found that thermal initiator used for this work contributes to improving the hardness and modulus values up to 0.175 and 3.585 GPa, while the UV transmittance value is still above 75%. The optimized soft replica mold built on a flexible plastic substrate allows submicron-scale patterns to be transferred onto a rigid Si substrate by means of UV-NIL process. Consequently, we demonstrate that the developed soft replica mold can be a suitable replacement for typical hard molds, promising further use in mold-based nanolithography for the fabrication of high-resolution nanopatterns over large areas. Copyright © 2014 American Scientific Publishers.
- KSP 제안 키워드
- 65 nm, Hardness and modulus, High-resolution, Plastic substrate, Si substrate, Thermal initiator, UV nanoimprint lithography, UV transmittance, UV-NIL, modulus properties, replica mold