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Journal Article Application of Thermal Initiator for Characteristic Improvements of Polymeric Replica Mold for UV Nanoimprint Lithography
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Authors
Ye-Sul Jeong, Jaehoon Park, Bong Kuk Lee, Jin-Hwa Ryu, Kyu-Ha Baek, Lee-Mi Do
Issue Date
2014-12
Citation
Journal of Nanoscience and Nanotechnology, v.14, no.8, pp.5932-5936
ISSN
1533-4880
Publisher
American Scientific Publishers (ASP)
Language
English
Type
Journal Article
DOI
https://dx.doi.org/10.1166/jnn.2014.8800
Abstract
We report the improvement of the hardness and modulus properties in a silsesquioxane-based soft replica mold by adding thermal initiator, without deteriorating the UV transmittance at the wavelength of 365 nm. It is found that thermal initiator used for this work contributes to improving the hardness and modulus values up to 0.175 and 3.585 GPa, while the UV transmittance value is still above 75%. The optimized soft replica mold built on a flexible plastic substrate allows submicron-scale patterns to be transferred onto a rigid Si substrate by means of UV-NIL process. Consequently, we demonstrate that the developed soft replica mold can be a suitable replacement for typical hard molds, promising further use in mold-based nanolithography for the fabrication of high-resolution nanopatterns over large areas. Copyright © 2014 American Scientific Publishers.
KSP Keywords
65 nm, Hardness and modulus, High resolution, Nanoimprint lithography(NIL), Plastic substrate, Replica mold, Si substrate, Thermal initiator, UV nanoimprint lithography(UV-NIL), UV transmittance, modulus properties