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Conference Paper
Hybrid-integrated Coherent Receiver using Silica-based Planar Lightwave Circuit Technology
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- Authors
- Jong-Hoi Kim, Joong-Seon Choe, Kwang-Seong Choi, Chun-Ju Youn, Duk-Jun Kim, Sun-Hyok Jang, Yong-Hwan Kwon, Eun-Soo Nam
- Issue Date
- 2011-11
- Citation
- Asia Communications and Photonics Conference (ACP) 2011, pp.1-6
- Publisher
- IEEE
- Language
- English
- Type
- Conference Paper
- Abstract
- A hybrid-integrated coherent receiver module has been achieved using flip-chip bonding technology, consisting of a silica-based 90째-hybrid planar lightwave circuit (PLC) platform, a spot-size converter integrated waveguide photodiode (SSC-WG-PD), and a dual-channel transimpedance amplifier (TIA). The receiver module shows error-free operation up to 40Gb/s and OSNR sensitivity of 11.5 dB for BER = 10-3 at 25 Gb/s. © 2011 SPIE-OSA-IEEE.
- KSP Keywords
- Bonding technology, Coherent receiver, Flip-chip(FC), Flip-chip bonding, Integrated waveguide, Planar lightwave circuit(PLC), Receiver module, Silica-based, Spot size converter(SSC), Transimpedance Amplifier(TIA), Waveguide photodiodes(WGPD)