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Journal Article
A Thin Film Encapsulation Layer Fabricated via Initiated Chemical Vapor Deposition and Atomic Layer Deposition
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- Authors
- Bong Jun Kim, Do Heung Kim, Seung Youl Kang, Seong Deok Ahn, Sung Gap Im
- Issue Date
- 2014-12
- Citation
- Journal of Applied Polymer Science, v.131, no.24, pp.1-7
- ISSN
- 0021-8995
- Publisher
- John Wiley & Sons
- Language
- English
- Type
- Journal Article
- Abstract
- An organic/inorganic hybrid multilayer for encapsulation of organic electronic devices is developed, where the organic polymer layer and the inorganic layer are alternatively deposited by initiated chemical vapor deposition and atomic layer deposition processes, respectively. The thickness of each organic and inorganic layer is optimized to minimize the water vapor transmission rate (WVTR) determined by a Ca test. The produced barrier film shows an outstanding optical property as its light transmittance is average 89.42% at visible light region. The WVTR of the developed thin film encapsulation layer is as low as 2.17 × 10-4 g m-2 day-1 at 38°C, 90% relative humidity (RH). This value is equivalent to 1.29 × 10-5 g m-2 day-1 at ambient condition, which is sufficient to elongate the lifetime of organic electronic devices.
- KSP Keywords
- As 2, Atomic Layer Deposition, Barrier films, Encapsulation layer, Initiated Chemical Vapor Deposition, Relative Humidity(RH), Thin film encapsulation, Visible Light, Water vapor transmission rate, ambient conditions, deposition process