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Journal Article High‐performance stacked‐coil transformers with thick metal layers
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Authors
Cheol Ho Kim, Bonghyuk Park
Issue Date
2014-09
Citation
Electronics Letters, v.50, no.19, pp.1359-1361
ISSN
0013-5194
Publisher
IET
Language
English
Type
Journal Article
DOI
https://dx.doi.org/10.1049/el.2014.2502
Abstract
Miniaturised stacked-coil radio-frequency (RF) transformers were fabricated with thick metal layers using the low-cost anodised aluminium substrate process. The transformer consists of a 34 μm-thick substrate-buried copper lower coil and a 30 μm-thick copper/gold upper coil with a 3 μm-thick benzocyclobutene (BCB) interlayer between the coils. Owing to extremely low losses and tight coupling, the fabricated transformers achieved very low insertion losses as low as 0.28 dB and high maximum available gains of up to 0.96 at GHz frequencies. The results verify that the stacked-coil transformer with thick metal layers can be a promising component for high-performance miniaturised RF circuits.
KSP Keywords
Aluminium substrate, Anodised aluminium, High performance, Low-cost, RF circuits, Radio-frequency, Thick substrate, Tight Coupling, insertion loss, metal layer, thick Copper