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학술지 High-Performance Stacked-Coil Transformers with Thick Metal Layers
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저자
김철호, 박봉혁
발행일
201409
출처
Electronics Letters, v.50 no.19, pp.1359-1361
ISSN
0013-5194
출판사
IET
DOI
https://dx.doi.org/10.1049/el.2014.2502
협약과제
14MI8100, 밀리미터파 5G 이동통신 시스템 개발, 김태중
초록
Miniaturised stacked-coil radio-frequency (RF) transformers were fabricated with thick metal layers using the low-cost anodised aluminium substrate process. The transformer consists of a 34 μm-thick substrate-buried copper lower coil and a 30 μm-thick copper/gold upper coil with a 3 μm-thick benzocyclobutene (BCB) interlayer between the coils. Owing to extremely low losses and tight coupling, the fabricated transformers achieved very low insertion losses as low as 0.28 dB and high maximum available gains of up to 0.96 at GHz frequencies. The results verify that the stacked-coil transformer with thick metal layers can be a promising component for high-performance miniaturised RF circuits.
KSP 제안 키워드
Aluminium substrate, Anodised aluminium, High performance, Low-cost, RF circuits, Radio Frequency(RF), Thick substrate, Tight Coupling, insertion loss, metal layer, thick Copper