Showing 36881-36890 of 40,118.
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
|
Conference
|
2001 | Design and implementation of component repository for supporting the component based development process Jung-Eun Cha International Conference on Systems, Man and Cybernetics (SMC) 2001, pp.735-740 | ||
|
Conference
|
2001 | Yes/no discrimination with spatio-temporal characteristics of EEG Min-Joon Kim International Conference of the IEEE Engineering in Medicine and Biology Society (EMBS) 2001, pp.2009-2012 | ||
|
Conference
|
2001 | Component adaptation using adaptation pattern components Jeong Ah Kim International Conference on Systems, Man and Cybernetics (SMC) 2001, pp.1025-1029 | 8 | |
|
Conference
|
2001 | A dead reckoning algorithm with variable threshold scheme in networked virtual environment Kwang-Hyun Shim International Conference on Systems, Man and Cybernetics (SMC) 2001, pp.1113-1118 | ||
|
Conference
|
2001 | Colour image difference analysis: quantitative versus qualitative methods Byoung-Ho Kang International Conference on Systems, Man and Cybernetics (SMC) 2001, pp.2291-2294 | ||
|
Conference
|
2001 | The design and implementation of Enterprise JavaBean (EJB) wrapper for legacy system Moon-Soo Lee International Conference on Systems, Man and Cybernetics (SMC) 2001, pp.1988-1992 | ||
|
Conference
|
2001 | Adaptive hierarchical stereo matching using object segmentation and window warping Jae-Chul Kim International Conference on Systems, Man and Cybernetics (SMC) 2001, pp.2295-2300 | ||
|
Conference
|
2001 | A New Stack Buffer Overflow Hacking Defense Technique with Memory Address Confirmation Yang Seo Choi International Conference on Information Security and Cryptology (ICISC) 2001 (LNCS 2288), v.2288, pp.146-159 | 1 | |
|
Conference
|
2002 | The effect of via size on fine pitch and high density solder bumps for wafer level packaging Chul-Won Ju Electronic Components and Technology Conference (ECTC) 2002, pp.1178-1181 | ||
|
Conference
|
2002 | Design of electrostatic actuators for MOEMS applications Dooyoung Hah Design, Test, Integration, and Packaging of MEMS/MOEMS 2002 (SPIE 4755), pp.200-207 | 24 |