Showing 37801-37810 of 40,901.
Type | Year | Title | Cited | Download |
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Conference
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2013 | Single-Photon Level Geiger-Mode InGaAs Detector in TO module at Room-Temperature International Symposium on the Physics of Semiconductors and Applications (ISPSA) 2013, pp.1-1 | ||
Conference
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2013 | Sound Field Sensing Technology for Intelligent Surveillance Service Kang-Ho Park International Symposium on Optical Memory (ISOM) 2013, pp.144-145 | ||
Conference
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2013 | Thermally Activated Bumping Process using Sn3.0Ag0.5Cu Solder Powder for Low-Cost Interposers Kwang-Seong Choi International Symposium on Microelectronics (IMAPS) 2013, pp.420-423 | 0 | |
Journal
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2017 | The Computation Reduction in Object Detection via Composite Structure of Modified Integral Images Daeha LEE IEICE Transactions on Information and Systems, v.E100.D, no.1, pp.229-233 | 0 | |
Conference
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2012 | Effects of Textured Morphology on the Short Circuit Current Density of Silicon Heterojunction Solar Cells International Conference on Electronic Materials and Nanotechnology for Green Environment (ENGE) 2012, pp.1-1 | ||
Conference
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2012 | A Study on Cu2O Thin Film for the Color-adjusting Layer of Transparent a-Si:H Solar Cell International Conference on Electronic Materials and Nanotechnology for Green Environment (ENGE) 2012, pp.1-1 | ||
Conference
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2012 | Blocking behavior of buffer layer for ITO electrode formed on the chemically strengthened glass International Conference on Electronic Materials and Nanotechnology for Green Environment (ENGE) 2012, pp.1-1 | ||
Conference
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2012 | Efficient Isolation of Electrophoretic Ink by Micro-Patterned Lines International Conference on Electronic Materials and Nanotechnology for Green Environment (ENGE) 2012, pp.1-1 | ||
Conference
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2012 | Fabrication of projected capacitive-type window-unified 15” touch sensor International Conference on Electronic Materials and Nanotechnology for Green Environment (ENGE) 2012, pp.1-1 | ||
Conference
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2012 | Secured routing protocol for wireless sensor network Jang Sik Bae International Symposium on Embedded Technology (ISET) 2012, pp.77-79 |