Subjects : Al wire
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2021 | Thermal and Electrical Reliability Analysis of TO-247 for Bonding Method, Substrate Structure and Heat Dissipation Bonding Material Donghwan Kim Electronic Components and Technology Conference (ECTC) 2021, pp.1950-1956 | 5 | 원문 |
| Conference | 2017 | Al wire bonding process of Power Semiconductor packaging process Oh Ae Sun 대한전자공학회 종합 학술 대회 (하계) 2017, pp.229-231 |
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| Type | Year | Research Project | Primary Investigator | Download |
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