Subjects : Open failure
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2016 | Thermal and Electrical Designs of RF 3D Module Based on Si Interposers with Redundant TSVs Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2016, pp.2051-2057 | 2 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
|---|---|---|---|---|---|
| No search results. | |||||
| Type | Year | Research Project | Primary Investigator | Download |
|---|---|---|---|---|
| No search results. | ||||