Subjects : 1200 V
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2020 | Multi-layer Ceramic based Surface Mount Device Packaging for 1200 V and 1700 V SiC SBD Power Semiconductors Jung Dong Yun International Conference on Consumer Electronics (ICCE) 2020 : Asia, pp.603-606 | 4 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
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| Type | Year | Research Project | Primary Investigator | Download |
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