Subjects : High thermal reliability
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2017 | Low-temperature Sintering Behavior of Ternary Solder and Copper Powder for High-Power Device Packaging Eom Yong Sung European Microelectronics and Packaging Conference (EMPC) 2017, pp.1-4 | 0 | 원문 |
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| Type | Year | Research Project | Primary Investigator | Download |
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