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Journal
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2022 |
Evaluation of the Reliability and Lifetime Prediction of 150 GHz Athermal AWG Module with Metal Temperature Compensation Board
Yun Kwang Su Processes, v.10, no.10, pp.1-15 |
2 |
원문
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Conference
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2019 |
Lifetime Prediction and Failure Analysis based on Accelerated Life Test of AWG Module for Optical Communication
Yun Kwang Su International Conference on Materials and Reliability (ICMR) 2019, pp.7-8 |
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Journal
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2015 |
Life Test of an X-band MMIC Multi-Function Chip for Active Phased Array Radar Applications
Jeong Jin Cheol Microelectronics Reliability, v.55, no.5, pp.815-821 |
10 |
원문
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