Subjects : conduction and convection
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2019 | A Study of Overflowed Epoxy Resin in a Butt-coupling with FAB and EML Mounted on PCB for a Compact Optic Design of Ethernet 100G/400G CWDM4 Data Center Application Lee Jyung Chan Asia Communications and Photonics Conference (ACP) 2019, pp.1-3 | 3 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
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| Type | Year | Research Project | Primary Investigator | Download |
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