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Journal
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2012 |
Formation of Metal and Dielectric Liners Using a Solution Process for Deep Trench Capacitors
Ham Yong-Hyun Journal of Nanoscience and Nanotechnology, v.12, no.7, pp.5897-5901 |
1 |
원문
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Journal
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2011 |
Conformal Deposition of an Insulator Layer and Ag Nano Paste Filling of a through Silicon Via for a 3D Interconnection
Baek Kyu-Ha Journal of the Korean Physical Society, v.59, no.3, pp.2252-2258 |
10 |
원문
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Journal
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2011 |
Dual Etch Processes of Via and Metal Paste Filling for Through Silicon Via Process
함용현 Thin Solid Films, v.519, no.20, pp.6727-6731 |
26 |
원문
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