|
Conference
|
2020 |
Development of bonding process for flexible devices with fine-pitch interconnection using Anisotropic Solder Paste and Laser-Assisted Bonding Technology
Jiho Joo Electronic Components and Technology Conference (ECTC) 2020, pp.1309-1314 |
13 |
원문
|
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Journal
|
2016 |
Substrate embedded low temperature co‐fired ceramics antenna with wide beamwidth and high gain at millimetre‐wave band
Kim Dong-Young Electronics Letters, v.52, no.2, pp.98-100 |
2 |
원문
|
|
Conference
|
2014 |
Power Noise Isolation in a Silicon Interposer with Through Silicon Vias
Myunghoi Kim Electronics Packaging Technology Conference (EPTC) 2014, pp.805-808 |
0 |
원문
|
|
Conference
|
2004 |
Plastic thermally controllable platform with integrated thin film microcomponents
Dae-Sik Lee Micro- and Nanotechnology: Materials, Processes, Packaging, and Systems II (SPIE 5650), pp.429-437 |
0 |
원문
|