Subjects : Vertical interconnection
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2012 | 3D SiP Module Using TSV and Novel Low-Volume Solder-on-Pad(SoP) Process Bae Hyun-Cheol Electronic System-Integration Technology Conference (ESTC) 2012, pp.1-4 | 1 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
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| Type | Year | Research Project | Primary Investigator | Download |
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