Subjects : Volumetric ratio
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Journal | 2016 | Thermoelectric Cooler Module with Enhanced Cooling Ability Using a Hybrid Cu Paste and a Si Substrate Bae Hyun-Cheol Journal of Nanoscience and Nanotechnology, v.16, no.12, pp.12732-12736 | 2 | 원문 |
| Journal | 2013 | Fine‐Pitch Solder on Pad Process for Microbump Interconnection Bae Hyun-Cheol ETRI Journal, v.35, no.6, pp.1152-1155 | 25 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
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| Type | Year | Research Project | Primary Investigator | Download |
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