Subjects : Direct bonding
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2022 | Heat Dissipation Design of High-Power Wide-Bandgap Power Module with Insulated Metal Substrate Jeong Bongmin International Conference and Exhibition on High Temperature Electronics Network (HiTEN) 2022, pp.66-70 |
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|---|---|---|---|---|---|
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| Type | Year | Research Project | Primary Investigator | Download |
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