Subjects : Chain length
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Journal | 2018 | Crosslinkable deoxidizing hybrid adhesive of epoxy–diacid for electrical interconnections in semiconductor packaging Keonsoo Jang Polymer International, v.67, no.9, pp.1241-1247 | 24 | 원문 |
| Journal | 2006 | Adsorption Behavior of Binary Mixed Alkanethiol Molecules on Au: Scanning Tunneling Microscope and Linear-Scan Voltammetry Investigation 김용관 Applied Surface Science, v.252, no.14, pp.4951-4956 | 14 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
|---|---|---|---|---|---|
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| Type | Year | Research Project | Primary Investigator | Download |
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