Subjects : Heat dissipation rate
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Journal | 2017 | Power Semiconductor SMD Package Embedded in Multilayered Ceramic for Low Switching Loss Jung Dong Yun ETRI Journal, v.39, no.6, pp.866-873 | 12 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
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| Type | Year | Research Project | Primary Investigator | Download |
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