|
Conference
|
2023 |
Process Window of Mini-LED Display Panel Packaging using Laser Assisted Bonding Technology
Eom Yong Sung European Microelectronics and Packaging Conference (EMPC) 2023, pp.1-4 |
1 |
원문
|
|
Journal
|
2006 |
Fabrication and characterization of a spot-size converter-integrated 1.3 µm FP laser diode
Chung Yong-Duck Semiconductor Science and Technology, v.21, no.6, pp.790-793 |
3 |
원문
|
|
Journal
|
2003 |
1.55-μm spot-size converter integrated laser diode with conventional buried-heterostructure laser process
Sang-Wan Ryu IEEE Photonics Technology Letters, v.15, no.1, pp.12-14 |
13 |
원문
|