Subjects : Thermal experiment
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Journal | 2023 | Machine Learning‐Based Solution for Thermomechanical Analysis of MMIC Packaging 강수민 ADVANCED MATERIALS TECHNOLOGIES, v.8, no.5, pp.1-8 | 4 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
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| Type | Year | Research Project | Primary Investigator | Download |
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