Subjects : No-flow underfill
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Journal | 2016 | Curing Kinetics and Chemorheological Behavior of No-flow Underfill for Sn/In/Bi Solder in Flexible Packaging Applications Eom Yong Sung ETRI Journal, v.38, no.6, pp.1179-1189 | 5 | 원문 |
| Conference | 2014 | Maskless Screen Printing Technology for 20μm-Pitch, 52InSn Solder Interconnections in Display Applications Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2014, pp.1154-1159 | 8 | 원문 |
| Journal | 2012 | Novel Bumping and Underfill Technologies for 3D IC integration 성기준 ETRI Journal, v.34, no.5, pp.706-712 | 31 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
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| Type | Year | Research Project | Primary Investigator | Download |
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