Subjects : Solder materials
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2021 | Simultaneous Transfer and Bonding (SITRAB) Process for Micro-LEDs Using Laser-Assisted Bonding with Compression (LABC) Process and SITRAB Adhesive Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2021, pp.1607-1613 | 15 | 원문 |
| Conference | 2017 | Low-temperature Sintering Behavior of Ternary Solder and Copper Powder for High-Power Device Packaging Eom Yong Sung European Microelectronics and Packaging Conference (EMPC) 2017, pp.1-4 | 0 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
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| Type | Year | Research Project | Primary Investigator | Download |
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