Subjects : back grinding
| Type | Year | Title | Cited | Download | 
|---|---|---|---|---|
| Journal | 2013 | Micromachined stress-free TSV hole for AlGaN/GaN-on-Si (1 1 1) platform-based devices Sang Choon Ko Journal of Micromechanics and Microengineering, v.23, no.3, pp.1-7 | 3 | 원문 | 
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS | 
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| Type | Year | Research Project | Primary Investigator | Download | 
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