Subjects : Rheological phenomena
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2014 | Flip-Chip Bonding Processes with Low Volume SoP Technology Eom Yong Sung Electronic System-Integration Technology Conference (ESTC) 2014, pp.1-4 | 0 | 원문 |
| Journal | 2010 | Chemo-Rheological Characteristics of a Self-Assembling Anisotropic Conductive Adhesive System Containing a Low-Melting Point Solder 백지원 Microelectronic Engineering, v.87, no.10, pp.1968-1972 | 32 | 원문 |
| Journal | 2008 | Characterization of Polymer Matrix and Low Melting Point Solder for Anisotropic Conductive Film Eom Yong Sung Microelectronic Engineering, v.85, no.2, pp.327-331 | 64 | 원문 |
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| Type | Year | Research Project | Primary Investigator | Download |
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