Subjects : Resistance measurement
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Journal | 2025 | Reliability Enhancement of 30 μm-Pitch Interconnections via Room-Temperature Laser-Assisted Bonding with Compression (LABC) Using Optimized Laser Non-Conductive Paste (LNCP) Lee Gaeun Journal of Korean Institute of Metals and Materials, v.63, no.8, pp.583-593 | 0 | 원문 |
| Journal | 2016 | Sn58Bi Solder Interconnection for Low-Temperature Flex-on-Flex Bonding Haksun Lee ETRI Journal, v.38, no.6, pp.1163-1171 | 14 | 원문 |
| Conference | 2013 | Novel Interconnection Technology for Flex-on-Glass (FOG) Applications Haksun Lee European Microelectronics and Packaging Conference (EMPC) 2013, pp.1-5 | ||
| Conference | 2002 | The Effects of Plasma Induced Damage on The Channel Layers of Ion Implanted GaAs MESFETs during Reactive Ion Etching(RIE) and Plasma Ashing Processes Hokyun Ahn Materials Research Society (MRS) Meeting 2002 (Spring), v.720, pp.67-72 | 1 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
|---|---|---|---|---|---|
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| Type | Year | Research Project | Primary Investigator | Download |
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