Subjects : Bonding temperature
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2023 | Anisotropic Solder Paste (ASP) Material Solution for Laser Assisted Bonding (LAB) Process Jang Ki Seok European Microelectronics and Packaging Conference (EMPC) 2023, pp.1-4 | 0 | 원문 |
| Journal | 2019 | Conductive adhesive with transient liquid‐phase sintering technology for high‐power device applications Eom Yong Sung ETRI Journal, v.41, no.6, pp.820-828 | 11 | 원문 |
| Conference | 2014 | Maskless Screen Printing Technology for 20μm-Pitch, 52InSn Solder Interconnections in Display Applications Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2014, pp.1154-1159 | 8 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
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| Type | Year | Research Project | Primary Investigator | Download |
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