Subjects : excellent uniformity
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2010 | Solder Bump Maker with Coining Process on TSV Chips for 3D Packages 성기준 International Conference on Electronic Packaging Technology and High Density Packaging (ICEPT-HDP) 2010, pp.185-189 | 4 | 원문 |
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| Type | Year | Research Project | Primary Investigator | Download |
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