Subjects : Field emission Auger electron spectroscopy
Type | Year | Title | Cited | Download |
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Journal | 2014 | The Fabrication of an Applicative Device for Trench Width and Depth Using Inductively Coupled Plasma and the Bulk Silicon Etching Process Woo Jong Chang Transactions on Electrical and Electronic Materials, v.15, no.1, pp.49-54 | 1 | 원문 |
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