|
Conference
|
2023 |
2.5D Large-Scale Interposer Bonding Process Verification using Daisy-Chain for PIM Heterogeneous Integration Platform
Sujin Park International Conference on Electronics, Information and Communication (ICEIC) 2023, pp.1-3 |
0 |
원문
|
|
Journal
|
2010 |
A Fully Integrated Transmitter with Embedded Antenna for On-Wafer Wireless Testing
Park Pil Jae IEEE Transactions on Microwave Theory and Techniques, v.58, no.5, pp.1456-1463 |
4 |
원문
|
|
Conference
|
2009 |
On-Wafer Wireless Testing and Mismatch Monitoring Using RF Transmitters with Integrated Antennas
Park Pil Jae Radio Frequency Integrated Circuits Symposium (RFIC) 2009, pp.505-508 |
5 |
원문
|