Subjects : Section analysis
Type | Year | Title | Cited | Download |
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Conference | 2013 | Novel Interconnection Technology for Flex-on-Glass (FOG) Applications Haksun Lee European Microelectronics and Packaging Conference (EMPC) 2013, pp.1-5 |
Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
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Type | Year | Research Project | Primary Investigator | Download |
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