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Conference
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2023 |
94GHz Fan-Out Wafer-Level Packaging (FOWLP) for High-Resolution Proximity Sensors, Autonomous Driving, and 5G/6G Telecommunication Systems
Jiho Joo International Symposium on Microelectronics and Packaging (ISMP) 2023, pp.1-23 |
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Conference
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2014 |
Case Study on Analysis for Well-Structured Internals and Complexity of Software for Common Criteria
Choi Jeong Rhan 한국정보처리학회 학술 발표 대회 (추계) 2014, pp.642-645 |
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Journal
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2010 |
Functional Unit Duplication for Reducing Dynamic Power
Shin Chihoon IEICE Electronics Express, v.7, no.2, pp.98-104 |
0 |
원문
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