Subject

Subjects : Uniform temperature

  • Articles (3)
  • Patents (0)
  • R&D Reports (0)
논문 검색결과
Type Year Title Cited Download
Conference 2024 Laser Assisted Bonding (LAB) based Flip-chip process for fine pitch solder bumps device using Laser Non-Conductive Paste (NCP)   Jang Ki Seok  Electronic System-Integration Technology Conference (ESTC) 2024, pp.1-4 0 원문
Journal 2018 Proposal of Novel Structure for Wide Wavelength Tuning in Distributed Bragg Reflector Laser Diode with Single Grating Mirror   Kwon Oh Kee  Optics Express, v.26, no.22, pp.1-9 15 원문
Conference 2006 Continuous-Flow Polymerase Chain Reaction (PCR) Device using a Disposable Polymer Disk   Chung Kwang Hyo  International Conference on Miniaturized Systems for Chemistry and Life Sciences (Micro TAS) 2006, pp.1426-1428
특허 검색결과
Status Year Patent Name Country Family Pat. KIPRIS
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연구보고서 검색결과
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