Subjects : Lead-free material
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2012 | Novel Low-Volume Solder-on-Pad (SoP) Material and Process for Flip Chip Bonding Using Au Stud Bumps Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2012, pp.1919-1924 | 1 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
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| Type | Year | Research Project | Primary Investigator | Download |
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