Subjects : Low-carbon
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2024 | Low-Carbon Epoxy-Siloxane Flux Technology for Fine-Pitch Solder Bump Interconnection Gwang-Mun Choi International Symposium on Microelectronics and Packaging (ISMP) 2024, pp.164-164 | ||
| Conference | 2022 | Laser-Assisted Bonding (LAB) Process and its Bonding Materials as Technologies enabling the Low-Carbon Era Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2022, pp.196-203 | 7 | 원문 |
| Journal | 2010 | OLED 조명 기술 동향 Chu Hye Yong 주간기술동향, v.1475, pp.22-32 |
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| Type | Year | Research Project | Primary Investigator | Download |
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