Subjects : Clip bonding
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2021 | Thermal and Electrical Reliability Analysis of TO-247 for Bonding Method, Substrate Structure and Heat Dissipation Bonding Material Donghwan Kim Electronic Components and Technology Conference (ECTC) 2021, pp.1950-1956 | 5 | 원문 |
| Conference | 2018 | Thermal Analysis of SiC Power Semiconductor with Copper Clip Bonding and Copper Sintering Paste Inhoo Kim International Microsystems, Packaging, Assembly and Circuits Technology Conference (IMPACT) 2018, pp.1-4 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
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| Type | Year | Research Project | Primary Investigator | Download |
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