Subjects : Thermo-compression
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Journal | 2025 | Reliability Enhancement of 30 μm-Pitch Interconnections via Room-Temperature Laser-Assisted Bonding with Compression (LABC) Using Optimized Laser Non-Conductive Paste (LNCP) Lee Gaeun Journal of Korean Institute of Metals and Materials, v.63, no.8, pp.583-593 | 0 | 원문 |
| Conference | 2024 | Laser Assisted Bonding (LAB) based Flip-chip process for fine pitch solder bumps device using Laser Non-Conductive Paste (NCP) Jang Ki Seok Electronic System-Integration Technology Conference (ESTC) 2024, pp.1-4 | 0 | 원문 |
| Conference | 2013 | Novel Interconnection Technology for Flex-on-Glass (FOG) Applications Haksun Lee European Microelectronics and Packaging Conference (EMPC) 2013, pp.1-5 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
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| Type | Year | Research Project | Primary Investigator | Download |
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