Subjects : electronic interconnection
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Journal | 2010 | Characteristics of Via-Hole Interconnections Fabricated by Using an Inkjet Printing Method Yong Suk Yang Journal of the Korean Physical Society, v.57, no.61, pp.1699-1701 | 5 | 원문 |
| Journal | 2009 | Catalytic Behavior of Sn/Bi Metal Powder in Anhydride-Based Epoxy Curing Keonsoo Jang Journal of Nanoscience and Nanotechnology, v.9, no.12, pp.7461-7466 | 31 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
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| Type | Year | Research Project | Primary Investigator | Download |
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