|
Journal
|
2016 |
Curing Kinetics and Chemorheological Behavior of No-flow Underfill for Sn/In/Bi Solder in Flexible Packaging Applications
Eom Yong Sung ETRI Journal, v.38, no.6, pp.1179-1189 |
5 |
원문
|
|
Conference
|
2014 |
Maskless Screen Printing Technology for 20μm-Pitch, 52InSn Solder Interconnections in Display Applications
Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2014, pp.1154-1159 |
8 |
원문
|
|
Journal
|
2012 |
Novel Bumping and Underfill Technologies for 3D IC integration
성기준 ETRI Journal, v.34, no.5, pp.706-712 |
31 |
원문
|