Subject

Subjects : Positional accuracy

  • Articles (2)
  • Patents (0)
  • R&D Reports (0)
논문 검색결과
Type Year Title Cited Download
Conference 2025 Environmentally Friendly Cu Post Technology Based on Laser-Assisted Bonding with Compression (LABC) and Fume-Free Laser Solder Paste for Advanced 3D Interconnections   Choi Kwang-Seong  Electronic Components and Technology Conference (ECTC) 2025, pp.1952-1957 0 원문
Journal 2013 Automated HRSI Georegistration Using Orthoimage and SRTM: Focusing KOMPSAT-2 Imagery   Oh Jaehong  Computers & Geosciences, v.52, pp.77-84 18 원문
특허 검색결과
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연구보고서 검색결과
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