Subjects : Smart properties
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2010 | 3D SiP Module using TSV and Novel Solder Bump Maker Bae Hyun-Cheol Electronic Components and Technology Conference (ECTC) 2010, pp.1637-1641 | 5 | 원문 |
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| Type | Year | Research Project | Primary Investigator | Download |
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