Subjects : Connection area
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2023 | 2.5D Large-Scale Interposer Bonding Process Verification using Daisy-Chain for PIM Heterogeneous Integration Platform Sujin Park International Conference on Electronics, Information and Communication (ICEIC) 2023, pp.1-3 | 0 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
|---|---|---|---|---|---|
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| Type | Year | Research Project | Primary Investigator | Download |
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