Subjects : Process reliability
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2019 | Development of Laser-Assisted Bonding with Compression (LABC) Process for 3D IC Integration Choi Kwang-Seong International 3D Systems Integration Conference (3DIC) 2019, pp.1-3 | 3 | 원문 |
| Journal | 2006 | Fabrication of Nano-Gap Electrode Pairs Using Atomic-Layer-Deposited Sacrificial Layer and Shadow Deposition Park Chan Woo Japanese Journal of Applied Physics, v.45, no.5A, pp.4293-4295 | 1 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
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| Type | Year | Research Project | Primary Investigator | Download |
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