Subjects : Test study
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Conference | 2024 | Chip-on-Wafer (CoW) Technology Utilizing LaserAssisted Bonding with Compression (LABC) for Bump Counts Exceeding 500,000 at a 20m Pitch Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2024, pp.943-948 | 2 | 원문 |
| Conference | 2023 | Laser-Assisted Bonding with Compression (LABC) based Tiling Bonding Technology, Enabling Technology for Chiplet Integration Choi Kwang-Seong Electronic Components and Technology Conference (ECTC) 2023, pp.1385-1389 | 5 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
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| Type | Year | Research Project | Primary Investigator | Download |
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