Subjects : 3D integrated circuit
| Type | Year | Title | Cited | Download |
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| Conference | 2009 | High-Quality LTCC Solenoid Inductor Using Air Cavity on Silicon Wafer for 3D Integrated Circuit Bae Hyun-Cheol International Conference and Exhibition on Device Packaging (IMAPS) 2009, pp.1-1 |
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| Type | Year | Research Project | Primary Investigator | Download |
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