Subjects : Stencil printing
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Journal | 2014 | Characterization and Estimation of Solder-on-Pad Process for Fine-Pitch Applications Haksun Lee IEEE Transactions on Components, Packaging, and Manufacturing Technology, v.4, no.10, pp.1729-1738 | 15 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
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| Type | Year | Research Project | Primary Investigator | Download |
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