Subject

Subjects : Phenomenological models

  • Articles (1)
  • Patents (0)
  • R&D Reports (0)
논문 검색결과
Type Year Title Cited Download
Journal 2016 Curing Kinetics and Chemorheological Behavior of No-flow Underfill for Sn/In/Bi Solder in Flexible Packaging Applications   Eom Yong Sung  ETRI Journal, v.38, no.6, pp.1179-1189 4 원문
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