Subjects : shock reliability
| Type | Year | Title | Cited | Download |
|---|---|---|---|---|
| Journal | 2022 | Thermal shock reliability of micro–nano bimodal Cu–Ag sintered joints Son Kirak Journal of Materials Science : Materials in Electronics, v.33, pp.17493-17501 | 2 | 원문 |
| Status | Year | Patent Name | Country | Family Pat. | KIPRIS |
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| Type | Year | Research Project | Primary Investigator | Download |
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